Photoimageable Coverlay
FSTEM's photosensitive coverlay is primarily designed to replace traditional coverlay and solder mask ink. It offers numerous advantages including simplified processing, ultra-thin profile, excellent flatness, superior flexibility, low rebound force, environmental friendliness, and precise window opening capability.
Dry Film Solder Resist
The FH Series Dry Film Solder Resist is a photosensitive protective film specifically developed for PCBs and IC substrates as a potential replacement for traditional liquid solder resist. Compared to conventional liquid solder resist, the FH Series features lower VOC emissions, environmental friendliness, excellent flatness, and ease of application. Additionally, it demonstrates superior filling capability, excellent heat resistance, high resolution, and outstanding flexibility.
