Flexible Copper Clad Laminates
FSTEM utilizes self-developed polymer materials such as polyimide varnish and epoxy resin to design diverse layer stack configurations. Combined with existing slot die coating technology and refined production processes to manfacture high performance FCCL.
Adhesive-Less Single-Sided FCCL Series
The FS series Adhesive-Less Single-Sided FCCL products are manufactured through precision coating and imidization process by using self-developed polyimide (PI) varnish and copper foil. These products exhibit excellent dimensional stability, flexibility, heat resistance, and electrical properties, making them suitable for high-performance single-layer and multilayer boards.
